Image shown is for reference only. Detailed specifications should be obtained from the data sheet.
BGA0035-S
| product_info | Soldering, Desoldering, Rework Products Solder Stencils, Templates Chip Quik Inc. BGA0035-S |
|---|---|
| Category | Soldering, Desoldering, Rework Products |
| Manufacturer | Chip Quik Inc. |
| Series | Proto-Advantage |
| Product Status | Active |
| Type | BGA |
| Number of Positions | 196 |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Thermal Center Pad | - |
| Material | Stainless Steel |
| Thickness | - |
| Datasheets | BGA0035-S Datasheet |
| HTML Datasheet | BGA0035-S Datasheet |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8515.19.0000 |
