Image shown is for reference only. Detailed specifications should be obtained from the data sheet.
BGA0027-S
| product_info | Soldering, Desoldering, Rework Products Solder Stencils, Templates Chip Quik Inc. BGA0027-S |
|---|---|
| Category | Soldering, Desoldering, Rework Products |
| Manufacturer | Chip Quik Inc. |
| Series | Proto-Advantage BGA |
| Product Status | Active |
| Type | BGA |
| Number of Positions | 121 |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Thermal Center Pad | - |
| Material | Stainless Steel |
| Thickness | 0.0040" (0.102mm) |
| Datasheets | BGA0027-S Datasheet |
| Video File | Prototyping with Solder Stencils - Another Teaching Moment, Digi-Key Electronics |
| HTML Datasheet | BGA0027-S Datasheet |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8534.00.0040 |
