Image shown is for reference only. Detailed specifications should be obtained from the data sheet.
BGA0009-S
| product_info | Soldering, Desoldering, Rework Products Solder Stencils, Templates Chip Quik Inc. BGA0009-S |
|---|---|
| Category | Soldering, Desoldering, Rework Products |
| Manufacturer | Chip Quik Inc. |
| Series | Proto-Advantage BGA |
| Product Status | Active |
| Type | BGA |
| Number of Positions | 484 |
| Outer Dimension | 2.600" L x 1.800" W (66.04mm x 45.72mm) |
| Thermal Center Pad | - |
| Material | Stainless Steel |
| Thickness | 0.0040" (0.102mm) |
| Video File | Prototyping with Solder Stencils - Another Teaching Moment, Digi-Key Electronics |
| Featured Product | Adapters, Breadboards, and Accessories |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8515.19.0000 |
